(also posted to the TEI News server: http://www.tei-c.org/News/index.xml#mm2010Call Please feel free to cross post)

Call for Bids: TEI Conference and Members Meeting, 2010

The annual TEI Conference and Members' Meeting takes place every year in late October or early November. We are now seeking bids to host this event in 2010.

The meeting this year (2009) will take place on November 11-15 at the University of Michigan in Ann Arbor, MI, USA. The previous meetings have been:

* London, England, November 6-8, 2008. hosted by King's College London. * College Park (MD), USA, October 31-November 3, 2007. Hosted by the University of Maryland. * Victoria, Canada, October 27-28, 2006. Hosted by the University of Victoria. * Sophia, Bulgaria, October 28-29, 2005. Hosted by the Bulgarian Academy of Sciences. * Baltimore, USA, October 22-23, 2004. Hosted by Johns Hopkins University. * Nancy, France, November 7-8 2003. Hosted by ATILF. * Chicago, USA, October 11-12 2002. Hosted by the Newberry Library and Northwestern University. * Pisa, Italy, November 16-17 2001. Hosted by the University of Pisa.

The site of the conference and meeting has typically alternated between Europe and North America, but that is not a fixed rule. We welcome proposals from other parts of the world, and in particular from areas where new TEI communities are arising.

This year's conference and meeting will be a four-day event (plus pre-conference workshops), with approximately 120 attendees. The three days of the main conference will include a mix of plenary lectures by invited speakers, round-table discussions, and conference-style sessions; there will also be a business meeting of the membership. The fourth day (Sunday) will be a closed session for members of the Board. Meetings of TEI Special Interest Groups (SIGs) may also scheduled for this day. Future meetings should assume roughly this shape, although there is considerable room for local initiative in consultation with the Board.

The TEI Consortium guarantees direct costs of the conference and meeting up to a maximum of US$5200 with special provisions for funding attendance in excess of approximately 120 attendees. The conference organising committee is also expected to seek additional funds from local institutions, commercial sponsors, and other organisations. A conference registration fee is charged to assist the TEI in recovering its expenditure and ensure that it is able to underwrite the cost of future conferences.

Bids should be sent to info@tei-c.org by no later than September 1, 2009, though institutions considering making a proposal are encouraged to contact chair of the TEI (daniel.odonnell@uleth.ca mailto:daniel.odonnell@uleth.ca) much earlier in the process in order to discuss their ideas. Bids should include the following information:

* The name of the institution(s) making the bid * The name, address, email, and telephone number of the contact person * A brief description of the facilities available for the event (rooms, equipment, technical support, food) * An indication of what financial support, if any, the hosting institution is prepared to give (for instance, sponsoring one or more receptions or pre-meeting workshops; payment of travel expenses for one or more plenary speakers; etc.) * Any other details that may be useful in assessing the bid (e.g. the presence of a conference on a related topic at the institution around the time of the meeting; the launch of a new TEI-related initiative at the institution, etc., ideas for a particular theme or focus).

In submitting bids, local organisers are encouraged to be creative: the TEI is willing to work with hosts to reflect local interests and strengths.

Further information about the requirements for the conference and members meeting may be found in our document on Hosting a Members Meeting http://www.tei-c.org/Membership/Meetings/meeting_hosting.xml and the Board's own Practices and Procedures http://www.tei-c.org/Board/procedures.xml#body.1_div.4 document.

All bids will be reviewed by the TEI board, which makes the final decision.